💼 Samsung may become a component manufacturer for Google's new AI chips
Samsung is in negotiations to manufacture the I/O die for Google's 10th generation TPU, codenamed Icefish. It is expected that Samsung will use its 2nm process to facilitate communication between the processor and high-speed HBM memory, while the main computing cores are planned to be ordered from TSMC using 1.4nm technology. Mass production for the project is scheduled for 2028.
🌍 Google is implementing a multi-foundry approach to diversify its supply chain and reduce dependence on TSMC amid capacity shortages. This opens an opportunity for Samsung to regain market share in advanced process technologies and compete in the supply chain of major AI players.
👤 This confirms the industry's shift toward complex multi-die architectures (chiplets), where different parts of a single AI processor can be manufactured at different foundries, changing the rules of the game in the race for chip performance.